If there is one trend in technology today, it is that more products are talking to each other. Radio frequency (RF) and related technologies such as Bluetooth, wifi, Ethernet, satellite, near field communications (NFC) and GPS are pervasive. So are the challenges that come with RF technology. TeligentEMS has been a leader in RF technology-related manufacturing for more than 30 years. We understand the common manufacturability issues that can create unacceptable electrical noise or other communications issues. We have a proven track record of supporting customers as they go through regulatory qualification testing and we understand how to optimize testability in volume production. We also have the ability to support customer needs for configure-to-order programming/labeling, test and pack on products that require serialization. We have a proven track record supporting ruggedized communications products, making us an excellent choice for products that must operate in harsh environments or in situations where they are frequently subjected to shock and vibration, such as transportation and construction applications.

Key Elements

  • Able to provide design for manufacturability/testability (DFM/DFT) recommendations
  • Ability to provide product lifecycle management analysis and/or obsolescence risk mitigation strategies
  • Ability to support customer-specific product and process qualification requirements
  • Cost competitive global and local sourcing options for medium-to-high volume sourcing requirements
    • Real-time visibility into supply chain status via TeligentEMS Purchase Order Tracking System (TPOTS)
    • Strong processes for ensuring compliance with Approved Vendor List (AVL)
  • Extensive experience with assembly and test requirements for a broad range of communications technologies including:
    • RF
    • Bluetooth
    • Wifi
    • Near-field communications (NFC)
    • Satellite
    • Ethernet
  • Proprietary Possible-X suite of production management tools which supports device history recordkeeping by providing:
    • Lot and component-level traceability
    • Quality data collection
  • Integrated inspection and process monitoring throughout production including:
    • 3D SPI
    • AOI
    • X-ray inspection
  • Broad range of test support including:
    • Flying probe
    • ICT
    • Functional
    • RF screening
    • ESS
    • Hi-pot
    • Centrifuge
  • Secondary operations supporting product robustness in harsh environments:
    • Conformal coating
    • Potting/encapsulation
    • RTV and other bonding agents