Assembly Services

TeligentEMS provides a complete complement of manufacturing services from prototype to production to include mechanical, electronic and system level assembly, prototyping, new product introduction, printed circuit board assembly, in-circuit testing, functional testing, final system box build.

By utilizing its considerable Supply Chain Management capability, TeligentEMS provides complete turnkey services to its customers. TeligentEMS does not compromise on quality while meeting the customer demands to shorten time to market.

Lean manufacturing concepts are an integral part of the manufacturing methods employed at TeligentEMS and provide a significant benefit to our customers by reducing factory lead times, increasing inventory turn rates, and allowing TeligentEMS to dynamically and efficiently respond to customer schedule changes.
TeligentEMS supports printed circuit board assembly services for a variety of technologies including Thru-Hole, SMT, BGA, and Micro BGA. Experienced manufacturing engineers design poka yoke processes that utilize state of the art equipment. These factors combined with skilled manufacturing personnel create a repeatable platform for continued success.
Full system integration is a significant part of our business. TeligentEMS provides assembly services from mechanical assemblies to complex optical assemblies.

Printed Circuit Board Assembly capabilities include: Thru-hole SMT Ultra-Fine Pitch Micro BGA BGA Rigid Flexible Circuits Programming of IC’s Conformal Coating No-Clean Soldering Lead Free Soldering System level assembly capabilities include: Optical Assembly Mechanical assembly Backplanes Higher-level Assemblies Cabling Fiber Technology